Direct implementation board(metal) - メーカー・企業と製品の一覧

High-precision, high-density chip direct mounting on substrates ODM [Technical and field materials provided]

We possess wafer processing, various COB, and flip chip technologies! These can be applied to ultra-small sensor systems, electronic medical devices, and optoelectronic equipment.

AEMtec GmbH offers advanced chip direct mounting technology for optoelectronics and sensor systems. We possess various mounting technologies, including wafer processing, high-precision chip mounting, component mounting, unitization, and modularization. These technologies can be applied to various ultra-small sensor systems, wearable electronic medical devices, and optoelectronic device mounting. 【Mounting Technologies We Offer】 ■ Wafer Processing: UBM, balls, die processing ■ High-Precision Chip Mounting: Flip chip, chip on board ■ Component Mounting: Surface mounting ■ Unitization and Modularization: Providing mounted substrates in special shapes *For more details, please refer to the PDF document or feel free to contact us.

• 企業：AEMtec GmbH 日本事務所
• 価格：Other

• Other electronic parts